High-Aspect-Ratio Copper Via Filling Used for Three-Dimensional Chip Stacking
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of The Electrochemical Society
سال: 2003
ISSN: 0013-4651
DOI: 10.1149/1.1572154